Tempfix™ Adhesive Specimen Mount Set 2.5um 4x3mm die: Bump height (about

4x3mm die: Bump height (about 50nm) and width (about 150nm) not calibrated

Built on the high-performance RFESP-75 AFM probe

Hole Width 19µm

5 Tip Radius (Nom): 10 Tip Radius (Max): 15 Tip Set Back (Nom): 15 Tip Set Back( RNG): 5 - 25 Tilt Compensation: 3

Tempfix™ Adhesive Specimen Mount Set 2.5um 4x3mm die: Bump height (aboutDESCRIPTION Excellent for particulate specimens such as powders, particles, pollens, insects, dried samples and similar fine matter Tempfix is a non conductive thermoplastic hot melt adhesive resin, especially formulated for SEM studies. It does not contain solvents and is stable under high vacuum. Its adhesive characteristics appear in the 40 120C range. Melting starts at 40C and it becomes a thin fluid at 120C, displaying a wide viscosity range. It