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Ø32mm x 6mm pin height; shorter pin for all Zeiss/LEO SEM, FESEM & FIB systems Unit:pkg/100 Technical Notes (PDF 79KB) TEM

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Description

Technical Notes (PDF 79KB) TEM substrates on 300 mesh TEM grids

Boot for Second Generation Dimension EC Cell

55 Cantilever Thickness (RNG): 0

FIB or FESEM and can be used for calibration purposes well below 100nm and goes beyond the features available on other calibration standards

Ø32mm x 6mm pin height; shorter pin for all Zeiss/LEO SEM, FESEM & FIB systems Unit:pkg/100 Technical Notes (PDF 79KB) TEMDESCRIPTION 32mm x 6mm pin height; shorter pin for all Zeiss LEO SEM, FESEM & FIB systems ZEISS LEO SEM, FESEM & FIB systems, aluminum, grooved edge, 32mm

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